Abstract
Optical interconnects are a core technology for scaling AI/ML networks by linking NPU/GPUs directly or through ethernet switches with each other. With switch and link capacities doubling every 2 years, CPO (co-packaged optics) and OIO (optical Input/Output) connectivity solutions are emerging for tackling multiple challenges simultaneously: Reduction of power consumption and latency, and the increase of shoreline bandwidth density. In this work we explore the scaling limitations of DR-based (Direct Reach, parallel fiber output) CPO devices and demonstrate how densely-spaced WDM CPO variants can overcome this bottleneck, while simultaneously supporting a maximum switch radix, within the framework of Horizon Europe project ADOPTION. We demonstrate the first generation of (de-)multiplexer technology and their impact on transmission quality and network architecture.
| Original language | English |
|---|---|
| Title of host publication | Optical Interconnects and Packaging 2026 |
| Publisher | SPIE |
| Number of pages | 8 |
| Volume | 13903 |
| DOIs | |
| Publication status | Published - 4 Mar 2026 |
Keywords
- Co-packaged optics
- Port breakout
- WDM
- AWG
- Demultiplexing
- PLC
- [TyndallPhotonics]
- [Physics]
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