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Radix-expanded densely-spaced WDM technology for co-packaged optics switches

  • R. Palmer
  • , C. Antony
  • , B. Zheng
  • , M. P. G. Rombouts
  • , J. Sarkis
  • , N. Calabretta
  • , P. D. Townsend
  • , G. Talli
  • , M. Kuschnerov

Research output: Chapter in Book/Report/Conference proceedingsConference proceedingpeer-review

Abstract

Optical interconnects are a core technology for scaling AI/ML networks by linking NPU/GPUs directly or through ethernet switches with each other. With switch and link capacities doubling every 2 years, CPO (co-packaged optics) and OIO (optical Input/Output) connectivity solutions are emerging for tackling multiple challenges simultaneously: Reduction of power consumption and latency, and the increase of shoreline bandwidth density. In this work we explore the scaling limitations of DR-based (Direct Reach, parallel fiber output) CPO devices and demonstrate how densely-spaced WDM CPO variants can overcome this bottleneck, while simultaneously supporting a maximum switch radix, within the framework of Horizon Europe project ADOPTION. We demonstrate the first generation of (de-)multiplexer technology and their impact on transmission quality and network architecture.
Original languageEnglish
Title of host publicationOptical Interconnects and Packaging 2026
PublisherSPIE
Number of pages8
Volume13903
DOIs
Publication statusPublished - 4 Mar 2026

Keywords

  • Co-packaged optics
  • Port breakout
  • WDM
  • AWG
  • Demultiplexing
  • PLC
  • [TyndallPhotonics]
  • [Physics]

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