Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing

K. Gradkowski; H. C. Wang; D. S. Kumar; S. Collins; S. Butler; H. Y. Hwang; W. Noell; K. Shortiss; J. Parra; G. Fiol; K. O. Velthaus; P. O’Brien

doi:10.1117/12.3042451

Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing

K. Gradkowski
, H. C. Wang
, D. S. Kumar
, S. Collins
, S. Butler
, H. Y. Hwang
, W. Noell
, K. Shortiss
, J. Parra
, G. Fiol
, K. O. Velthaus
, P. O’Brien

Focuslight Switzerland SA
University College Cork
Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

We present a photonic packaging paradigm where the light from an edge coupler of a photonic integrated circuit is turned normal to the surface using a specially-manufactured silicon micro-lens equipped with an etched turning prism. Due to expansion of the beam, the alignment tolerances of coupling to similarly-equipped fiber array are significantly relaxed making it compatible with the future surface-mounted pluggable solutions. We demonstrate sub-2 dB coupling efficiency at 1310 nm from a transceiver chip.

Original language	English
Title of host publication	Proceedings Volume 13372, Optical Interconnects and Packaging 2025; 133720E (2025)
DOIs	https://doi.org/10.1117/12.3042451
Publication status	Published - 2025
Event	Optical Interconnects and Packaging 2025 - San Francisco, United States Duration: 28 Jan 2025 → 31 Jan 2025

Conference

Conference	Optical Interconnects and Packaging 2025
Country/Territory	United States
City	San Francisco
Period	28/01/25 → 31/01/25

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

Expanded Beam Connectors
Micro-Optics
Photonic Integrated Circuits
Photonic Packaging
Scalable Packaging

Access to Document

10.1117/12.3042451

Cite this

Gradkowski, K., Wang, H. C., Kumar, D. S., Collins, S., Butler, S., Hwang, H. Y., Noell, W., Shortiss, K., Parra, J., Fiol, G., Velthaus, K. O., & O’Brien, P. (2025). Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing. In Proceedings Volume 13372, Optical Interconnects and Packaging 2025; 133720E (2025) https://doi.org/10.1117/12.3042451

@inproceedings{7e06e901b2bf458f95d0a1d6c36cc417,

title = "Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing",

abstract = "We present a photonic packaging paradigm where the light from an edge coupler of a photonic integrated circuit is turned normal to the surface using a specially-manufactured silicon micro-lens equipped with an etched turning prism. Due to expansion of the beam, the alignment tolerances of coupling to similarly-equipped fiber array are significantly relaxed making it compatible with the future surface-mounted pluggable solutions. We demonstrate sub-2 dB coupling efficiency at 1310 nm from a transceiver chip.",

keywords = "Expanded Beam Connectors, Micro-Optics, Photonic Integrated Circuits, Photonic Packaging, Scalable Packaging",

author = "K. Gradkowski and Wang, \{H. C.\} and Kumar, \{D. S.\} and S. Collins and S. Butler and Hwang, \{H. Y.\} and W. Noell and K. Shortiss and J. Parra and G. Fiol and Velthaus, \{K. O.\} and P. O{\textquoteright}Brien",

note = "Publisher Copyright: {\textcopyright} 2025 SPIE.; Optical Interconnects and Packaging 2025 ; Conference date: 28-01-2025 Through 31-01-2025",

year = "2025",

doi = "10.1117/12.3042451",

language = "English",

booktitle = "Proceedings Volume 13372, Optical Interconnects and Packaging 2025; 133720E (2025)",

}

Gradkowski, K, Wang, HC, Kumar, DS, Collins, S, Butler, S, Hwang, HY, Noell, W, Shortiss, K, Parra, J, Fiol, G, Velthaus, KO & O’Brien, P 2025, Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing. in Proceedings Volume 13372, Optical Interconnects and Packaging 2025; 133720E (2025). Optical Interconnects and Packaging 2025, San Francisco, United States, 28/01/25. https://doi.org/10.1117/12.3042451

TY - GEN

T1 - Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing

AU - Gradkowski, K.

AU - Wang, H. C.

AU - Kumar, D. S.

AU - Collins, S.

AU - Butler, S.

AU - Hwang, H. Y.

AU - Noell, W.

AU - Shortiss, K.

AU - Parra, J.

AU - Fiol, G.

AU - Velthaus, K. O.

AU - O’Brien, P.

PY - 2025

Y1 - 2025

N2 - We present a photonic packaging paradigm where the light from an edge coupler of a photonic integrated circuit is turned normal to the surface using a specially-manufactured silicon micro-lens equipped with an etched turning prism. Due to expansion of the beam, the alignment tolerances of coupling to similarly-equipped fiber array are significantly relaxed making it compatible with the future surface-mounted pluggable solutions. We demonstrate sub-2 dB coupling efficiency at 1310 nm from a transceiver chip.

AB - We present a photonic packaging paradigm where the light from an edge coupler of a photonic integrated circuit is turned normal to the surface using a specially-manufactured silicon micro-lens equipped with an etched turning prism. Due to expansion of the beam, the alignment tolerances of coupling to similarly-equipped fiber array are significantly relaxed making it compatible with the future surface-mounted pluggable solutions. We demonstrate sub-2 dB coupling efficiency at 1310 nm from a transceiver chip.

KW - Expanded Beam Connectors

KW - Micro-Optics

KW - Photonic Integrated Circuits

KW - Photonic Packaging

KW - Scalable Packaging

UR - https://www.scopus.com/pages/publications/105004317062

U2 - 10.1117/12.3042451

DO - 10.1117/12.3042451

M3 - Conference proceeding

AN - SCOPUS:105004317062

BT - Proceedings Volume 13372, Optical Interconnects and Packaging 2025; 133720E (2025)

T2 - Optical Interconnects and Packaging 2025

Y2 - 28 January 2025 through 31 January 2025

ER -

Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing

Abstract

Conference

UN SDGs

Keywords

Access to Document

Other files and links

Fingerprint

Cite this