Recent advances in fiber-to-PIC packaging technologies for scalable manufacturing
- K. Gradkowski
- , H. C. Wang
- , D. S. Kumar
- , S. Collins
- , S. Butler
- , H. Y. Hwang
- , W. Noell
- , K. Shortiss
- , J. Parra
- , G. Fiol
- , K. O. Velthaus
- , P. O’Brien
- Focuslight Switzerland SA
- Fraunhofer Institute for Telecommunications, Heinrich Hertz Institute
Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review