@inbook{4fc16d3f03a94a9bb22fc51fca9d941c,
title = "Reliability evaluation of high-pincount hermetic ceramic IC packages for space applications",
abstract = "The results to date of a reliability testing program for the European Space Agency on high pincount hermetic ceramic packages are presented. Results are presented from work on: application of scanning acoustic microscopy (SAM) to die attach and lid seal quality assessment; the use of thermal characterization test chips and a computer-controlled thermal resistance measurement system to measure thermal impedances of ceramic quad flat pack (CQFP) and ceramic pin grid array (CPGA) packages; numerical prediction and practical measurement of electrical parasitics of CQFP and CPGA packages; quality and reliability testing of CQFP and GPGA packages; and quality and reliability testing of 20 and 25 mil pitch surface mount solder assemblies of high pincount CQFP packages assembled on printed circuit boards.",
author = "J. Barrett and T. Hayes and R. Doyle and C. O'Mathuna and T. Yamada and A. Boetti",
year = "1992",
month = jan,
language = "English",
isbn = "0818626607",
series = "Proceedings - Electronic Components Conference",
publisher = "Publ by IEEE",
pages = "190--199",
booktitle = "Proceedings - Electronic Components Conference",
note = "Proceedings of the 42nd Electronic Components and Technology Conference ; Conference date: 18-05-1992 Through 20-05-1992",
}