Review of integrated magnetics for Power Supply on Chip (PwrSoC)

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Abstract

This paper reviews the current state of power supply technology platforms and highlights future trends and challenges toward realizing fully monolithic power converters. This paper presents a detailed survey of relevant power converter technologies, namely power supply in package and power supply on chip (PwrSoC). The performance of different power converter solutions reported in the literature is benchmarked against existing commercial products. This paper presents a detailed review of integrated magnetics technologies, primarily microinductors, a key component in realizing a monolithic power converter. A detailed review and comparison of different microinductor structures and the magnetic materials used as inductor cores is presented. The deposition techniques for integrating the magnetic materials in the microinductor structures are discussed. This paper proposes the use of two performance metrics or figures of merit in order to compare the dc and ac performance of individual microinductor structures. Finally, the authors discuss future trends, key challenges, and potential solutions in the realization of the "holy grail" of monolithically integrated power supplies (PwrSoC).

Original languageEnglish
Article number6211434
Pages (from-to)4799-4816
Number of pages18
JournalIEEE Transactions on Power Electronics
Volume27
Issue number11
DOIs
Publication statusPublished - 2012

Keywords

  • High-frequency soft-magnetic materials
  • integrated passives
  • magnetics on silicon
  • nano-structured magnetic materials
  • power supply in package
  • power supply on chip

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