Abstract
The effects of solder flux residues on the electrical functionality of RF circuit boards are investigated in this paper. The electrical characteristics of the residues are tested in terms of the change in response of microstrip resonator structures caused by their presence. In this way, the corresponding change in effective dielectric constant of microstrip boards is measured, and can be used to predict residue effects on RF circuit performance. Residues deposited from five no-clean solder pastes are tested and compared, using microstrip resonator structures designed for operation over the frequency range from 0.5 - 10 GHz.
| Original language | English |
|---|---|
| Pages (from-to) | 138-143 |
| Number of pages | 6 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 4587 |
| Publication status | Published - 2001 |
| Event | 2001 International Symposium on Microelectronics - Baltimore, MD, United States Duration: 9 Oct 2001 → 11 Oct 2001 |
Keywords
- Dielectric characterisation
- Flux residue
- No-clean solder
- RF characterisation
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