RF characterisation of no-clean solder flux residues

  • Maeve Duffy
  • , Liam Floyd
  • , Paul McCloskey
  • , Cian Ó Mathúna
  • , Karen Tellefsen
  • , Mike Liberatore
  • , A. Sreeram

Research output: Contribution to journalArticlepeer-review

Abstract

The effects of solder flux residues on the electrical functionality of RF circuit boards are investigated in this paper. The electrical characteristics of the residues are tested in terms of the change in response of microstrip resonator structures caused by their presence. In this way, the corresponding change in effective dielectric constant of microstrip boards is measured, and can be used to predict residue effects on RF circuit performance. Residues deposited from five no-clean solder pastes are tested and compared, using microstrip resonator structures designed for operation over the frequency range from 0.5 - 10 GHz.

Original languageEnglish
Pages (from-to)138-143
Number of pages6
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4587
Publication statusPublished - 2001
Event2001 International Symposium on Microelectronics - Baltimore, MD, United States
Duration: 9 Oct 200111 Oct 2001

Keywords

  • Dielectric characterisation
  • Flux residue
  • No-clean solder
  • RF characterisation

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