@inproceedings{98da8fd9d0aa4d28a709b400ea9392c4,
title = "Scaling of Integrated Photonic Packaging for Volume Manufacture",
abstract = "Existing technical challenges make packaging of Photonic Integrated Circuits (PICs) difficult to scale to high volumes. Significant challenges remain in areas such as efficient optical fiber coupling, light source and electronic device integration and thermal management. This paper will present some of the outstanding packaging challenges for PICs and what is being done to address them. In particular, details about the new European PIC Packaging Pilot Line will be presented. This includes development of standard photonic packaging building block, design rules and a novel approach to make available a wide range of advanced packaging technologies which are capable of scaling to high volumes.",
keywords = "design rules, mechanical packaging, optical. electrical, photonic integrated circuits, pilot line, scaling, thermal",
author = "Peter O'Brien",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 23rd International Conference on Optical MEMS and Nanophotonics, OMN 2018 ; Conference date: 29-07-2018 Through 02-08-2018",
year = "2018",
month = sep,
day = "4",
doi = "10.1109/OMN.2018.8454623",
language = "English",
isbn = "9781509063727",
series = "International Conference on Optical MEMS and Nanophotonics",
publisher = "IEEE Computer Society",
booktitle = "International Conference on Optical MEMS and Nanophotonics, OMN 2018 - Proceedings",
address = "United States",
}