Abstract
We investigate the potential of gadolinium silicate (GdSiO) as a thermally stable high-k gate dielectric in a gate first integration scheme. There silicon diffuses into gadolinium oxide (Gd2O3) from a silicon oxide (SiO2) interlayer specifically prepared for this purpose. We report on the scaling potential based on detailed material analysis. Gate leakage current densities and EOT values are compatible with an ITRS requirement for low stand by power (LSTP). The applicability of this GdSiO process is demonstrated by fully functional silicon on insulator (SOI) metal oxide semiconductor field effect transistors (MOSFETs).
| Original language | English |
|---|---|
| Pages (from-to) | 1642-1645 |
| Number of pages | 4 |
| Journal | Microelectronic Engineering |
| Volume | 86 |
| Issue number | 7-9 |
| DOIs | |
| Publication status | Published - Jul 2009 |
Keywords
- Gate first integration
- High-k dielectric
- Rare earth silicate
- Silicate formation