Abstract
High quality GaAs is selectively grown in 40 nm width Shallow Trench Isolation patterned structures. The patterned wafers have a V-shape Si (111) surface obtained by Tetramethylammonium hydroxide etching. By employing a SiCoNi™ pre-epi clean and two-step growth procedure (low temperature buffer and high temperature main layer), defects are effectively confined at the trench bottom, leaving a dislocation-free GaAs layer at the upper part. The high crystal quality is confirmed by transmission electron microscopy. Scanning spreading resistance microscopy indicates a high resistance of GaAs. The process conditions and GaAs material quality are highly compatible with Si technology platform.
| Original language | English |
|---|---|
| Article number | 062101 |
| Journal | Applied Physics Letters |
| Volume | 105 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - 11 Aug 2014 |
| Externally published | Yes |