Self-Packaged Inkjet-Printed Vertically Integrated RF Co-Designed Bandpass Filtering Baluns

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Abstract

A new class of self-packaged RF co-designed bandpass filtering baluns (BPF-Bs) is proposed with alongside a novel integration scheme utilizing vertically integrated inkjet-printed multicoupled transmission lines (TLs). Furthermore, the manuscript outlines a comprehensive design methodology for their realization, exploiting the design freedom afforded by a two-material inkjet printing process, which enables the creation of tightly coupled vertically integrated TLs. The concept has been verified experimentally through the manufacturing and testing of wideband (WB) and ultrawideband (UWB) BPF-B prototypes, having f0 = 5 GHz, footprints of 0.019 λg2 and 0.025 λg2, and 3 dB fractional bandwidths (FBWs) of 24% and 111%, respectively. For the WB and UWB designs, power loss, phase imbalance (PI), and amplitude imbalance (AI) were measured between 4.4 and 7.4 dB and 1.8-4.8 dB, 4° ± 4° and 2° ± 2°, and 0.45 ± 0.45 dB and 0.4 ± 0.4 dB, respectively.

Original languageEnglish
Pages (from-to)2124-2127
Number of pages4
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume14
Issue number11
DOIs
Publication statusPublished - 2024

Keywords

  • Additive manufacturing
  • filtering baluns
  • Marchand balun
  • multicoupled lines

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