@inbook{f681fa16906f4f6a8e3fe83327350fbf,
title = "Silicon Photonic 2.5D Integrated Multi-Chip Module Receiver",
abstract = "We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers.",
author = "Abrams, \{Nathan C.\} and Qixiang Cheng and Madeleine Glick and Moises Jezzini and Padraic Morrissey and Peter O'Brien and Keren Bergman",
note = "Publisher Copyright: {\textcopyright} 2020 OSA.; 2020 Conference on Lasers and Electro-Optics, CLEO 2020 ; Conference date: 10-05-2020 Through 15-05-2020",
year = "2020",
month = may,
language = "English",
series = "Conference Proceedings - Lasers and Electro-Optics Society Annual Meeting-LEOS",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2020 Conference on Lasers and Electro-Optics, CLEO 2020 - Proceedings",
address = "United States",
}