Silicon photonic 2.5D integrated multi-chip module receiver

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

We demonstrate the first 2.5D integrated, wavelength division multiplexing, silicon photonic receiver. The multi-chip module utilizes a silicon interposer to integrate the four-channel photonic cascaded microdisk receiver with four electronic transimpedance amplifiers.

Original languageEnglish
Title of host publicationCLEO
Subtitle of host publicationScience and Innovations, CLEO_SI 2020
PublisherOptica Publishing Group (formerly OSA)
ISBN (Print)9781943580767
DOIs
Publication statusPublished - 2020
EventCLEO: Science and Innovations, CLEO_SI 2020 - Washington, United States
Duration: 10 May 202015 May 2020

Publication series

NameOptics InfoBase Conference Papers
VolumePart F183-CLEO-SI 2020
ISSN (Electronic)2162-2701

Conference

ConferenceCLEO: Science and Innovations, CLEO_SI 2020
Country/TerritoryUnited States
CityWashington
Period10/05/2015/05/20

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