Abstract
Heteroepitaxial growth of AlN buffer layers directly on (101¯0) sapphire substrates by metalorganic vapour phase epitaxy has been investigated. A single-step growth procedure without a sapphire nitridation was employed resulting in mirror-like crack free ≈1.1-1.6μm thick AlN layers of single phase (112¯2) orientation. Trimethylaluminum pre-dose time and reactor pressure were optimized for surface roughness and crystal quality. The crystal quality was found to degrade with increasing pre-dose time and also reactor pressure. The smallest full width at half maximum value for on-axis X-ray rocking curve of the (112¯2) AlN layers was about 610 arcsec and 1480 arcsec along [1¯1¯23]AlN and [11¯00]AlN, respectively. The surface roughness, measured by atomic force microscopy using a 10×10μm2 area, was in the range 2.6-3.5 nm. A basal stacking fault density of (7±1)×105 cm-1 was estimated by transmission electron microscopy.
| Original language | English |
|---|---|
| Pages (from-to) | 94-99 |
| Number of pages | 6 |
| Journal | Journal of Crystal Growth |
| Volume | 414 |
| DOIs | |
| Publication status | Published - 15 Mar 2015 |
Keywords
- A3. Metalorganic vapour phase epitaxy
- B1. Nitrides
- B2. AlN
- B2. Semiconducting aluminum compounds
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