Skin effect suppressed NiFe/Cu electroplated multilayer wiring for high data-rate and low delay-time I/O interface board
- M. Yamaguchi
- , T. Yanai
- , H. Nakayama
- , R. Sai
- , H. Fujiwara
- , Y. Kitai
- , M. Sato
- , U. Sangawa
- Tohoku University
- Nagasaki University
- National Institute of Technology, Nagano College
- Panasonic Holdings Corporation
Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review