@inbook{c301f7294e1d4bdcbe4dece200eae9b1,
title = "Sodium silicate as an enabler for wafer bonding of glass substrates and lids",
abstract = "The outgassing challenge associated with using polymer-based die-attach adhesives for vacuum seal photonic packages is addressed in this extended abstract. In addition to this, die movement can occur after high temperature anodic bonding of the lid/cap wafer and substrate wafer due to low glass transition temperature of polymer based adhesive systems. This presents a challenge for photonic packages where photonic chip's positional accuracy is critical. Silicate based adhesives are presented as a solution to enable vacuum seal packaging of photonic chips.",
keywords = "curing, lid wafer, photonic package, Sodium silicate, wafer bonding",
author = "Parnika Gupta and Joseph O'Brien and Lee, \{Jun Su\} and Hwang, \{How Yuan\} and Kamil Gradkowski and Morrissey, \{Padraic E.\} and Peter O'Brien",
note = "Publisher Copyright: {\textcopyright} 2024 NordPac 2024 - 60th Annual Microelectronics and Packaging Conference and Exhibition. All rights reserved.; 60th Annual Microelectronics and Packaging Conference and Exhibition, NordPac 2024 ; Conference date: 11-06-2024 Through 13-06-2024",
year = "2024",
language = "English",
series = "NordPac 2024 - 60th Annual Microelectronics and Packaging Conference and Exhibition",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "NordPac 2024 - 60th Annual Microelectronics and Packaging Conference and Exhibition",
address = "United States",
}