Solder jet technology for advanced packaging

C. Gallagher; P. J. Hughes; P. Tassie; K. Rodgers; J. Barton; J. Justice; D. P. Casey

doi:10.1117/12.605679

Solder jet technology for advanced packaging

C. Gallagher
, P. J. Hughes
, P. Tassie
, K. Rodgers
, J. Barton
, J. Justice
, D. P. Casey

Research output: Contribution to journal › Article › peer-review

Abstract

Lowering optical packaging costs requires developments in new technologies. In this paper, solder ink-jet process is presented for flip-chip component assembly on planar, 3D, flex and stacked submounts and substrates. Applications for this technology are presented and include linear array in-vivo dosimeters, integrated GaN LED displays, telecomm submounts and wearable ambient systems. An important aspect of developing this technology is process reliability. In this study, the reliability of the solder to bump accurately and adhere to various target bond pads was evaluated as well as MIL standard shear tests to qualify the joint strength of the bump.

Original language	English
Article number	100
Pages (from-to)	615-621
Number of pages	7
Journal	Proceedings of SPIE - The International Society for Optical Engineering
Volume	5825
DOIs	https://doi.org/10.1117/12.605679
Publication status	Published - 2005
Event	Opto-Ireland 2005: Optoelectronics, Photonic Devices, and Optical Networks - Dublin, Ireland Duration: 4 Apr 2005 → 6 Apr 2005

Keywords

Inkjet
Low cost packaging; flip-chip
Solder

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10.1117/12.605679

Cite this

@article{8b4431ff8a024da59956837e29a6a10e,

title = "Solder jet technology for advanced packaging",

abstract = "Lowering optical packaging costs requires developments in new technologies. In this paper, solder ink-jet process is presented for flip-chip component assembly on planar, 3D, flex and stacked submounts and substrates. Applications for this technology are presented and include linear array in-vivo dosimeters, integrated GaN LED displays, telecomm submounts and wearable ambient systems. An important aspect of developing this technology is process reliability. In this study, the reliability of the solder to bump accurately and adhere to various target bond pads was evaluated as well as MIL standard shear tests to qualify the joint strength of the bump.",

keywords = "Inkjet, Low cost packaging; flip-chip, Solder",

author = "C. Gallagher and Hughes, \{P. J.\} and P. Tassie and K. Rodgers and J. Barton and J. Justice and Casey, \{D. P.\}",

year = "2005",

doi = "10.1117/12.605679",

language = "English",

volume = "5825",

pages = "615--621",

journal = "Proceedings of SPIE - The International Society for Optical Engineering",

issn = "0277-786X",

publisher = "SPIE",

note = "Opto-Ireland 2005: Optoelectronics, Photonic Devices, and Optical Networks ; Conference date: 04-04-2005 Through 06-04-2005",

}

TY - JOUR

T1 - Solder jet technology for advanced packaging

AU - Gallagher, C.

AU - Hughes, P. J.

AU - Tassie, P.

AU - Rodgers, K.

AU - Barton, J.

AU - Justice, J.

AU - Casey, D. P.

PY - 2005

Y1 - 2005

N2 - Lowering optical packaging costs requires developments in new technologies. In this paper, solder ink-jet process is presented for flip-chip component assembly on planar, 3D, flex and stacked submounts and substrates. Applications for this technology are presented and include linear array in-vivo dosimeters, integrated GaN LED displays, telecomm submounts and wearable ambient systems. An important aspect of developing this technology is process reliability. In this study, the reliability of the solder to bump accurately and adhere to various target bond pads was evaluated as well as MIL standard shear tests to qualify the joint strength of the bump.

AB - Lowering optical packaging costs requires developments in new technologies. In this paper, solder ink-jet process is presented for flip-chip component assembly on planar, 3D, flex and stacked submounts and substrates. Applications for this technology are presented and include linear array in-vivo dosimeters, integrated GaN LED displays, telecomm submounts and wearable ambient systems. An important aspect of developing this technology is process reliability. In this study, the reliability of the solder to bump accurately and adhere to various target bond pads was evaluated as well as MIL standard shear tests to qualify the joint strength of the bump.

KW - Inkjet

KW - Low cost packaging; flip-chip

KW - Solder

UR - https://www.scopus.com/pages/publications/27644536064

U2 - 10.1117/12.605679

DO - 10.1117/12.605679

M3 - Article

AN - SCOPUS:27644536064

SN - 0277-786X

VL - 5825

SP - 615

EP - 621

JO - Proceedings of SPIE - The International Society for Optical Engineering

JF - Proceedings of SPIE - The International Society for Optical Engineering

M1 - 100

T2 - Opto-Ireland 2005: Optoelectronics, Photonic Devices, and Optical Networks

Y2 - 4 April 2005 through 6 April 2005

ER -

Solder jet technology for advanced packaging

Abstract

Keywords

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