Some issues for microsystem packaging in plastic and 3D

A. Morrissey; G. Kelly; J. Alderman; J. Barrett; C. Lyden; L. O'Rourke

doi:10.1016/s0026-2692(98)00029-9

Some issues for microsystem packaging in plastic and 3D

A. Morrissey
, G. Kelly
, J. Alderman
, J. Barrett
, C. Lyden
, L. O'Rourke

Office of the Vice President for Research and Innovation

Research output: Contribution to journal › Article › peer-review

Abstract

This paper describes some of the key issues associated with the packaging of microsystems in plastic and 3D. These include hermeticity, residual stress, and thermal management. An example of packaging a silicon membrane pump is described which illustrates the residual stress problems associated with packaging devices in plastic. Alternative schemes based on the use of PCB spacer systems and PLCC off the shelf components are outlined.

Original language	English
Pages (from-to)	645-650
Number of pages	6
Journal	Microelectronics Journal
Volume	29
Issue number	9
DOIs	https://doi.org/10.1016/s0026-2692(98)00029-9
Publication status	Published - Sep 1998

Keywords

3D
Microsystem packaging
Plastic
Residual stress

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10.1016/s0026-2692(98)00029-9

Cite this

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title = "Some issues for microsystem packaging in plastic and 3D",

abstract = "This paper describes some of the key issues associated with the packaging of microsystems in plastic and 3D. These include hermeticity, residual stress, and thermal management. An example of packaging a silicon membrane pump is described which illustrates the residual stress problems associated with packaging devices in plastic. Alternative schemes based on the use of PCB spacer systems and PLCC off the shelf components are outlined.",

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author = "A. Morrissey and G. Kelly and J. Alderman and J. Barrett and C. Lyden and L. O'Rourke",

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AU - O'Rourke, L.

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AB - This paper describes some of the key issues associated with the packaging of microsystems in plastic and 3D. These include hermeticity, residual stress, and thermal management. An example of packaging a silicon membrane pump is described which illustrates the residual stress problems associated with packaging devices in plastic. Alternative schemes based on the use of PCB spacer systems and PLCC off the shelf components are outlined.

KW - 3D

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KW - Plastic

KW - Residual stress

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Some issues for microsystem packaging in plastic and 3D

Abstract

Keywords

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