State of the art in prediction of mechanical behaviour of microsystems

  • Maryna Lishchynska
  • , Nicolas Cordero
  • , Orla Slattery

Research output: Chapter in Book/Report/Conference proceedingsConference proceedingpeer-review

Abstract

Behavioural models as analytical expressions relating loading parameters, material properties, and geometry of the microstructure with its performance characteristics are essential items in the toolbox of MEMS designer. Unfortunately well-known classic equations derived for idealized macrostructures do not always work for microcomponents. Thus alternative behavioural models need to be developed. Establishing behavioural models of microsystems is an all-important but challenging task. This paper presents an overview of different approaches to predicting the mechanical behaviour of microsystems and problems that need to be addressed. Analytical and numerical techniques are mainly considered. The paper concentrates on the merits, utilities and wide applicability of numerical modelling of MEMS behaviour. The development of analytical expressions for predicting mechanical performance of microcantilever beams is demonstrated as a case study in this paper. Mathematical models of deflections of microcantilevers on supports (pillars or anchors) subjected to either uniform or concentrated external load were extracted from Finite Element simulations results and are presented in the paper. The models accurately predict deflections of considered microstructures.

Original languageEnglish
Title of host publicationProceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
EditorsL.J. Ernst, G.Q. Zhang, P. Rodgers, O. Saint Leger
Pages287-294
Number of pages8
Publication statusPublished - 2004
EventProceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004 - Brussels, Belgium
Duration: 10 May 200412 May 2004

Publication series

NameProceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004

Conference

ConferenceProceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004
Country/TerritoryBelgium
CityBrussels
Period10/05/0412/05/04

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