Statistical hot-carrier reliability simulation using a novel sPICE parameter evolution model

Research output: Chapter in Book/Report/Conference proceedingsConference proceedingpeer-review

Abstract

One of the key components in any circuit reliability simulation methodology is a strategy for predicting the hot-carrierinduced changes in device parameters during stress. In the context of SPICE MOSFET model parameter shifts, the parameter extraction methodology utilised contributes to the "ease" in which parameter degradation trends can be modelled. This paper will demonstrate that direct parameter extraction techniques produce more monotonic parameter degradation trends than conventional optimisation techniques. In addition, a novel approach for the modelling of the evolution of directly-extracted parameters during hot-carrier stress is presented. Finally, a statistical validation, comparing measured and simulated degraded ring oscillator data, is presented.

Original languageEnglish
Title of host publicationESSDERC 2000 - Proceedings of the 30th European Solid-State Device Research Conference
EditorsH. Grunbacher, Gabriel M. Crean, W. A. Lane, Frank A. McCabe
PublisherIEEE Computer Society
Pages616-619
Number of pages4
ISBN (Electronic)2863322486
ISBN (Print)9782863322482
DOIs
Publication statusPublished - 2000
Event30th European Solid-State Device Research Conference, ESSDERC 2000 - Cork, Ireland
Duration: 11 Sep 200013 Sep 2000

Publication series

NameEuropean Solid-State Device Research Conference
ISSN (Print)1930-8876

Conference

Conference30th European Solid-State Device Research Conference, ESSDERC 2000
Country/TerritoryIreland
CityCork
Period11/09/0013/09/00

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