Abstract
The impact of Si interstitial (Si i) flux suppression on the formation of P junctions by rapid thermal annealing (RTA) is demonstrated. Here we investigate the role of amorphization coupled with C co-implantation on P diffusion and its activation. From experiments on C co-implants in a-Si versus c-Si, we conclude that only a small fraction of C interacts with Si interstitials (Si i). We have demonstrated that optimization of implants followed by spike RTA yields extensions suitable for gate lengths of 30 nm, with vertical depth X j=20 nm (taken at 5×10 18 at./cm 3), abruptness of 3 nm/decade, and R s=326 Ω/□.
| Original language | English |
|---|---|
| Article number | 062102 |
| Journal | Applied Physics Letters |
| Volume | 89 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - 2006 |
| Externally published | Yes |
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