Surface activation using oxygen and nitrogen radical for Ge-Si Avalanche photodiode integration

  • Ki Yeol Byun
  • , Isabelle Ferain
  • , John Hayes
  • , Ran Yu
  • , Farzan Gity
  • , Cindy Colinge

Research output: Contribution to journalArticlepeer-review

Abstract

In this work, an alternative method for producing the single crystalline Ge-Si Avalanche photodiodes (APD) with low thermal budget was investigated. Structural and electrical investigations show that low temperature Ge to Si wafer bonding can be used to achieve successful APD integration. Based on the surface chemistry of the Ge layer, the buried interfaces were investigated using high resolution transmission electron microscopy as a function of surface activation after low temperature annealing at 200 and 300 °C. The hetero-interface was characterized by measuring forward and reverse currents.

Original languageEnglish
Pages (from-to)522-525
Number of pages4
JournalMicroelectronic Engineering
Volume88
Issue number4
DOIs
Publication statusPublished - Apr 2011

Keywords

  • Avalanche photodiodes
  • Ge to Si wafer bonding
  • Surface activation

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