TY - CHAP
T1 - Technology roadmapping for Power Supply in Package (PSiP) and Power Supply on Chip (PwrSoC)
AU - Foley, Raymond
AU - Waldron, Finbarr
AU - Slowey, John
AU - Alderman, Arnold
AU - Narveson, Brian
AU - Ó'Mathúna, Sean Cian
PY - 2010
Y1 - 2010
N2 - This paper presents a review and summary of the PSMA " PSiP2PwrSoC" Special Project that investigated the technology and performance underpinning recent commercial developments in Power Supply in Package and Power Supply on Chip. The results of the study are based on the identification of more than 28 commercial products, 6 of which were analyzed in detail, both physically and electrically. The methodology of the project is described and some of the salient results of this benchmarking effort are presented. In this work, a representative subset of the available commercial products was selected and a comprehensive physical, electrical and thermal performance analysis was carried out. The main aims of this analysis were to identify the components, materials and assembly technologies used, and to determine if the drive towards greater integration and higher power density affected the performance of newer devices. The results of the analysis were then used to determine the current state of the technology in this application space, to show how it has developed to date and to predict how it might progress in the future. These results are presented in a generic format that does not identify individual products. This project was co-sponsored by the PSMA and member companies. The final report of the project, which includes more detailed information on the reviews described here as well as considerable trending analysis, is now available.
AB - This paper presents a review and summary of the PSMA " PSiP2PwrSoC" Special Project that investigated the technology and performance underpinning recent commercial developments in Power Supply in Package and Power Supply on Chip. The results of the study are based on the identification of more than 28 commercial products, 6 of which were analyzed in detail, both physically and electrically. The methodology of the project is described and some of the salient results of this benchmarking effort are presented. In this work, a representative subset of the available commercial products was selected and a comprehensive physical, electrical and thermal performance analysis was carried out. The main aims of this analysis were to identify the components, materials and assembly technologies used, and to determine if the drive towards greater integration and higher power density affected the performance of newer devices. The results of the analysis were then used to determine the current state of the technology in this application space, to show how it has developed to date and to predict how it might progress in the future. These results are presented in a generic format that does not identify individual products. This project was co-sponsored by the PSMA and member companies. The final report of the project, which includes more detailed information on the reviews described here as well as considerable trending analysis, is now available.
UR - https://www.scopus.com/pages/publications/77952234499
U2 - 10.1109/APEC.2010.5433622
DO - 10.1109/APEC.2010.5433622
M3 - Chapter
AN - SCOPUS:77952234499
SN - 9781424447824
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 525
EP - 532
BT - APEC 2010 - 25th Annual IEEE Applied Power Electronics Conference and Exposition
T2 - 25th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2010
Y2 - 21 February 2010 through 25 February 2010
ER -