@inproceedings{20bf0710c02c473a983c4bb04691de0f,
title = "Test structure for electrical characterization of copper nanowire anisotropic conductive film (NW-ACF) for 3D stacking applications",
abstract = "Copper nanowire arrays (∼200 nm diameter) grown in porous polymer template is a potential low temperature interconnection technology compared to metal/metal or solder micro-bump interconnects for 3D chip stacking. To advance this technology, good understanding of material and process related electrical properties is required. In this paper, a stacked test chip module with copper daisy chain pattern, which is finished by ∼1 μm indium bonding layer, has been designed to extract the resistance and capacitance data of the NW-ACF.",
keywords = "3D chip stack, Capacitance, Interconnection resistance, Leakage current, NW-ACF (Nanowire Anisotropic Conductive Film), Thermocompression bonding",
author = "Jing Tao and Alan Mathewson and Razeeb, \{Kafil M.\}",
year = "2014",
doi = "10.1109/ICMTS.2014.6841487",
language = "English",
isbn = "9781479921928",
series = "IEEE International Conference on Microelectronic Test Structures",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "165--169",
booktitle = "2014 IEEE International Conference on Microelectronic Test Structures, ICMTS 2014 - Conference Proceedings",
address = "United States",
note = "27th International Conference on Microelectronic Test Structures, ICMTS 2014 ; Conference date: 24-03-2014 Through 27-03-2014",
}