Test structures for a MEMS SiOx/metal process

Research output: Contribution to conferencePaperpeer-review

Abstract

A CMOS-compatible surface micromachining process was established in which a range of microstructures was fabricated. A semi-analytical model describing the pull-in behavior of fixed-fixed beams was defined which takes into account the substantial stress absorption which was shown to take place likely at non-ideal beam anchors. Using this model, the elastic modulus and residual stress of the titanium were evaluated. Interferometry imaging and capacitance measurements were used to show that the anchor design used remains undeformed even under high voltages.

Original languageEnglish
Pages203-210
Number of pages8
Publication statusPublished - 2002
EventProceedings of The 2002 International Conference on Microelectronic Test Structures - Cork, Ireland
Duration: 8 Apr 200211 Apr 2002

Conference

ConferenceProceedings of The 2002 International Conference on Microelectronic Test Structures
Country/TerritoryIreland
CityCork
Period8/04/0211/04/02

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 9 - Industry, Innovation, and Infrastructure
    SDG 9 Industry, Innovation, and Infrastructure

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