Test structures for MCM-D technology characterization

In this paper we present a set of classic and novel test structures addressed to fully characterize multichip module (MCM) technologies. The structures have been implemented and fabricated in our D-type, flip-chip, ball grid array, silicon substrate technology. In this technology, a silicon chip is used as a substrate on which other commercial chips are flipped and soldered by a screen-printing method. These complex technologies have specific test problems that are solved with this approach. We have specially focused on the measurement of the effects of wafer rerouting on CMOS parameters, the chip-to-chip ball contact resistance, thermal behavior, yield, and reliability of the technology. Experimental results are shown, proving that this methodology is suitable for our technology and can also be applied to other different MCM technologies.