@conference{777d60f25ee44131b62a13e6b9a8698b,
title = "The European 3D Heterogeneous Integration Platform (e-BRAINS) - A particular focus on reliability and low-temperature processes for 3D Integrated Sensor Systems",
author = "Peter Ramm and Armin Klumpp and Josef Weber and Alan Mathewson and Razeeb, \{Kafil M.\} and Reinhard Pufall",
year = "2015",
language = "English",
note = "IMAPS 11th International Conference and Exhibition on Device Packaging, DPC 2015 ; Conference date: 16-03-2015 Through 19-03-2015",
}