The european 3D technology platform (e-CUBES)

Peter Ramm; Nicolas Lietaer; Walter De Raedt; Thomas Fritzsch; Thierry Hilt; Pascal Couderc; Christian Val; Alan Mathewson; Kafil M. Razeeb; Frank Stam; Armin Klumpp; Josef Weber; Maaike Taklo

The european 3D technology platform (e-CUBES)

Peter Ramm
, Nicolas Lietaer
, Walter De Raedt
, Thomas Fritzsch
, Thierry Hilt
, Pascal Couderc
, Christian Val
, Alan Mathewson
, Kafil M. Razeeb
, Frank Stam
, Armin Klumpp
, Josef Weber
, Maaike Taklo

Fraunhofer Institute for Reliability and Microintegration
SINTEF
Interuniversitair Micro-Elektronica Centrum
Commissariat à l’énergie atomique et aux énergies alternatives
3D-PLUS

Research output: Contribution to conference › Paper › peer-review

Original language	English
Pages	70-133
Number of pages	64
Publication status	Published - 2010
Event	International Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Spring Conference on Global Business Council, GBC 2010 - Scottsdale and Fountain Hills, AZ, United States Duration: 8 Mar 2010 → 11 Mar 2010

Conference

Conference	International Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Spring Conference on Global Business Council, GBC 2010
Country/Territory	United States
City	Scottsdale and Fountain Hills, AZ
Period	8/03/10 → 11/03/10

Cite this

Ramm, P., Lietaer, N., Raedt, W. D., Fritzsch, T., Hilt, T., Couderc, P., Val, C., Mathewson, A., Razeeb, K. M., Stam, F., Klumpp, A., Weber, J., & Taklo, M. (2010). The european 3D technology platform (e-CUBES). 70-133. Paper presented at International Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Spring Conference on Global Business Council, GBC 2010, Scottsdale and Fountain Hills, AZ, United States.

@conference{37f84be4225343aabfe384fff9159726,

title = "The european 3D technology platform (e-CUBES)",

author = "Peter Ramm and Nicolas Lietaer and Raedt, \{Walter De\} and Thomas Fritzsch and Thierry Hilt and Pascal Couderc and Christian Val and Alan Mathewson and Razeeb, \{Kafil M.\} and Frank Stam and Armin Klumpp and Josef Weber and Maaike Taklo",

year = "2010",

language = "English",

pages = "70--133",

note = "International Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Spring Conference on Global Business Council, GBC 2010 ; Conference date: 08-03-2010 Through 11-03-2010",

}

Ramm, P, Lietaer, N, Raedt, WD, Fritzsch, T, Hilt, T, Couderc, P, Val, C, Mathewson, A, Razeeb, KM, Stam, F, Klumpp, A, Weber, J & Taklo, M 2010, 'The european 3D technology platform (e-CUBES)', Paper presented at International Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Spring Conference on Global Business Council, GBC 2010, Scottsdale and Fountain Hills, AZ, United States, 8/03/10 - 11/03/10 pp. 70-133.

The european 3D technology platform (e-CUBES). / Ramm, Peter; Lietaer, Nicolas; Raedt, Walter De et al.
2010. 70-133 Paper presented at International Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Spring Conference on Global Business Council, GBC 2010, Scottsdale and Fountain Hills, AZ, United States.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - The european 3D technology platform (e-CUBES)

AU - Ramm, Peter

AU - Lietaer, Nicolas

AU - Raedt, Walter De

AU - Fritzsch, Thomas

AU - Hilt, Thierry

AU - Couderc, Pascal

AU - Val, Christian

AU - Mathewson, Alan

AU - Razeeb, Kafil M.

AU - Stam, Frank

AU - Klumpp, Armin

AU - Weber, Josef

AU - Taklo, Maaike

PY - 2010

Y1 - 2010

UR - https://www.scopus.com/pages/publications/84880051617

M3 - Paper

AN - SCOPUS:84880051617

SP - 70

EP - 133

T2 - International Conference and Exhibition on Device Packaging 2010, Held in Conjunction with the Spring Conference on Global Business Council, GBC 2010

Y2 - 8 March 2010 through 11 March 2010

ER -

The european 3D technology platform (e-CUBES)

Conference

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Cite this