@inbook{9ee22a1742ed4d5bab17b624f33087d0,
title = "The Open Innovation Photonics Pilot Line for northwest Europe (OIP4NWE) and its service offering",
abstract = "Within the Interreg North-West Europe project OIP4NWE, we have set up an open innovation next-generation pilot line for InP-based photonic integrated circuits (PICs) to improve PIC manufacturing and make packaging more reliable and affordable. We present the service offering within the different components of the pilot line, consisting of InP PIC manufacturing in the front-end, and external interfacing optics and packaging in the back-end. We also report on how we supported 6 European SMEs with an innovation support voucher with the OIP4NWE pilot line.",
keywords = "Foundry Service, InP, Manufacturing, Micro-Optics, Mode Conversion Structures, Optical Interposer, Packaging, Photonic Integrated Circuits",
author = "\{Van Erps\}, J. and Alessia Senes and Luc Augustin and Marc Rensing and Michael Heuken and Anders Thorsten and Akanksha Kapoor and Victor Dolores-Calzadilla",
note = "Publisher Copyright: {\textcopyright} 2024 SPIE.; Integrated Photonics Platforms III 2024 ; Conference date: 07-04-2024 Through 10-04-2024",
year = "2024",
doi = "10.1117/12.3017995",
language = "English",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "SPIE",
editor = "Baets, \{Roel G.\} and Peter O'Brien and Laurent Vivien",
booktitle = "Integrated Photonics Platforms III",
address = "United States",
}
