Thermal characterisation of vertical multichip modules MCM-V

C. Cahill; T. Compagno; J. O'Donovan; O. Slattery; C. O. Mathuna; J. Barrett; I. Drouhin; C. Val; J. P. Tigneres; J. Stern; P. Ivey; M. Masgrangeas; A. Coello-Vera

Thermal characterisation of vertical multichip modules MCM-V

C. Cahill
, T. Compagno
, J. O'Donovan
, O. Slattery
, C. O. Mathuna
, J. Barrett
, I. Drouhin
, C. Val
, J. P. Tigneres
, J. Stern
, P. Ivey
, M. Masgrangeas
, A. Coello-Vera

University College Cork

Research output: Contribution to journal › Article › peer-review

Abstract

This paper describes the thermal characterisation of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of ICs in a three dimensional cube of plastic moulding compound with the inter-chip electrical connections made on the outside faces of the cube. Steady state and transient thermal results are presented. Thermal measurements were carried out on modules containing eight specially designed package evaluation test chips. Simulation results are shown for two applications manufactured in the MCM-V technology; a 2W 16 chip 256MBit DRAM module and a 3W 9 chip image processing system

Original language	English
Pages (from-to)	10-16
Number of pages	7
Journal	Annual IEEE Semiconductor Thermal Measurement and Management Symposium
Publication status	Published - 1995
Event	Proceedings of the 1995 IEEE 11th Annual Semiconductor Thermal Measurement & Management Symposium - San Jose, CA, USA Duration: 7 Feb 1995 → 9 Feb 1995

Cite this

@article{3a0411fca10f4bc19985e2da2d81d0cb,

title = "Thermal characterisation of vertical multichip modules MCM-V",

abstract = "This paper describes the thermal characterisation of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of ICs in a three dimensional cube of plastic moulding compound with the inter-chip electrical connections made on the outside faces of the cube. Steady state and transient thermal results are presented. Thermal measurements were carried out on modules containing eight specially designed package evaluation test chips. Simulation results are shown for two applications manufactured in the MCM-V technology; a 2W 16 chip 256MBit DRAM module and a 3W 9 chip image processing system",

author = "C. Cahill and T. Compagno and J. O'Donovan and O. Slattery and Mathuna, \{C. O.\} and J. Barrett and I. Drouhin and C. Val and Tigneres, \{J. P.\} and J. Stern and P. Ivey and M. Masgrangeas and A. Coello-Vera",

year = "1995",

language = "English",

pages = "10--16",

journal = "Annual IEEE Semiconductor Thermal Measurement and Management Symposium",

issn = "1065-2221",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

note = "Proceedings of the 1995 IEEE 11th Annual Semiconductor Thermal Measurement \& Management Symposium ; Conference date: 07-02-1995 Through 09-02-1995",

}

TY - JOUR

T1 - Thermal characterisation of vertical multichip modules MCM-V

AU - Cahill, C.

AU - Compagno, T.

AU - O'Donovan, J.

AU - Slattery, O.

AU - Mathuna, C. O.

AU - Barrett, J.

AU - Drouhin, I.

AU - Val, C.

AU - Tigneres, J. P.

AU - Stern, J.

AU - Ivey, P.

AU - Masgrangeas, M.

AU - Coello-Vera, A.

PY - 1995

Y1 - 1995

N2 - This paper describes the thermal characterisation of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of ICs in a three dimensional cube of plastic moulding compound with the inter-chip electrical connections made on the outside faces of the cube. Steady state and transient thermal results are presented. Thermal measurements were carried out on modules containing eight specially designed package evaluation test chips. Simulation results are shown for two applications manufactured in the MCM-V technology; a 2W 16 chip 256MBit DRAM module and a 3W 9 chip image processing system

AB - This paper describes the thermal characterisation of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of ICs in a three dimensional cube of plastic moulding compound with the inter-chip electrical connections made on the outside faces of the cube. Steady state and transient thermal results are presented. Thermal measurements were carried out on modules containing eight specially designed package evaluation test chips. Simulation results are shown for two applications manufactured in the MCM-V technology; a 2W 16 chip 256MBit DRAM module and a 3W 9 chip image processing system

UR - https://www.scopus.com/pages/publications/0029231525

M3 - Article

AN - SCOPUS:0029231525

SN - 1065-2221

SP - 10

EP - 16

JO - Annual IEEE Semiconductor Thermal Measurement and Management Symposium

JF - Annual IEEE Semiconductor Thermal Measurement and Management Symposium

T2 - Proceedings of the 1995 IEEE 11th Annual Semiconductor Thermal Measurement & Management Symposium

Y2 - 7 February 1995 through 9 February 1995

ER -

Thermal characterisation of vertical multichip modules MCM-V

Abstract

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