Thermal characterization of vertical multichip modules MCM-V

Ciaran Cahill; Anthony Compagno; John O'Donovan; Orla Slattery; Sean Cian o Mathuna; John Barrett; Isabel Serthelon; Christian Val; Jean Philippe Tigneres; Jon Stern; Peter Ivey; Marc Masgrangeas; Augustin Coello-Vera

doi:10.1109/95.477462

Thermal characterization of vertical multichip modules MCM-V

Ciaran Cahill
, Anthony Compagno
, John O'Donovan
, Orla Slattery
, Sean Cian o Mathuna
, John Barrett
, Isabel Serthelon
, Christian Val
, Jean Philippe Tigneres
, Jon Stern
, Peter Ivey
, Marc Masgrangeas
, Augustin Coello-Vera

University College Cork

Research output: Contribution to journal › Article › peer-review

Abstract

This paper describes the thermal characterization of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of IC's in a three dimensional cube of plastic molding compound, with the inter-chip electrical connections made on the outside faces of the cube. Thermal measurements were carried out on two different sized modules containing eight specially designed package evaluation test chips. Steady state and transient thermal results are presented. Simulation results are shown for two applications manufactured using the MCM-V technology; a 2 W, 16 chip 256 MBit DRAM module and a 3 W, 9 chip image processing system.

Original language	English
Pages (from-to)	765-772
Number of pages	8
Journal	IEEE Transactions on Components Packaging and Manufacturing Technology Part A
Volume	18
Issue number	4
DOIs	https://doi.org/10.1109/95.477462
Publication status	Published - Dec 1995

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Cahill, C., Compagno, A., O'Donovan, J., Slattery, O., o Mathuna, S. C., Barrett, J., Serthelon, I., Val, C., Tigneres, J. P., Stern, J., Ivey, P., Masgrangeas, M., & Coello-Vera, A. (1995). Thermal characterization of vertical multichip modules MCM-V. IEEE Transactions on Components Packaging and Manufacturing Technology Part A, 18(4), 765-772. https://doi.org/10.1109/95.477462

@article{6620922c66654ec0bdde3d560a0cd979,

title = "Thermal characterization of vertical multichip modules MCM-V",

abstract = "This paper describes the thermal characterization of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of IC's in a three dimensional cube of plastic molding compound, with the inter-chip electrical connections made on the outside faces of the cube. Thermal measurements were carried out on two different sized modules containing eight specially designed package evaluation test chips. Steady state and transient thermal results are presented. Simulation results are shown for two applications manufactured using the MCM-V technology; a 2 W, 16 chip 256 MBit DRAM module and a 3 W, 9 chip image processing system.",

author = "Ciaran Cahill and Anthony Compagno and John O'Donovan and Orla Slattery and \{o Mathuna\}, \{Sean Cian\} and John Barrett and Isabel Serthelon and Christian Val and Tigneres, \{Jean Philippe\} and Jon Stern and Peter Ivey and Marc Masgrangeas and Augustin Coello-Vera",

year = "1995",

month = dec,

doi = "10.1109/95.477462",

language = "English",

volume = "18",

pages = "765--772",

journal = "IEEE Transactions on Components Packaging and Manufacturing Technology Part A",

issn = "1070-9886",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

number = "4",

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Cahill, C, Compagno, A, O'Donovan, J, Slattery, O, o Mathuna, SC, Barrett, J, Serthelon, I, Val, C, Tigneres, JP, Stern, J, Ivey, P, Masgrangeas, M & Coello-Vera, A 1995, 'Thermal characterization of vertical multichip modules MCM-V', IEEE Transactions on Components Packaging and Manufacturing Technology Part A, vol. 18, no. 4, pp. 765-772. https://doi.org/10.1109/95.477462

TY - JOUR

T1 - Thermal characterization of vertical multichip modules MCM-V

AU - Cahill, Ciaran

AU - Compagno, Anthony

AU - O'Donovan, John

AU - Slattery, Orla

AU - o Mathuna, Sean Cian

AU - Barrett, John

AU - Serthelon, Isabel

AU - Val, Christian

AU - Tigneres, Jean Philippe

AU - Stern, Jon

AU - Ivey, Peter

AU - Masgrangeas, Marc

AU - Coello-Vera, Augustin

PY - 1995/12

Y1 - 1995/12

N2 - This paper describes the thermal characterization of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of IC's in a three dimensional cube of plastic molding compound, with the inter-chip electrical connections made on the outside faces of the cube. Thermal measurements were carried out on two different sized modules containing eight specially designed package evaluation test chips. Steady state and transient thermal results are presented. Simulation results are shown for two applications manufactured using the MCM-V technology; a 2 W, 16 chip 256 MBit DRAM module and a 3 W, 9 chip image processing system.

AB - This paper describes the thermal characterization of a vertical multichip module (MCM-V) technology. The MCM-V technology encloses a stack of IC's in a three dimensional cube of plastic molding compound, with the inter-chip electrical connections made on the outside faces of the cube. Thermal measurements were carried out on two different sized modules containing eight specially designed package evaluation test chips. Steady state and transient thermal results are presented. Simulation results are shown for two applications manufactured using the MCM-V technology; a 2 W, 16 chip 256 MBit DRAM module and a 3 W, 9 chip image processing system.

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DO - 10.1109/95.477462

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JO - IEEE Transactions on Components Packaging and Manufacturing Technology Part A

JF - IEEE Transactions on Components Packaging and Manufacturing Technology Part A

IS - 4

ER -

Thermal characterization of vertical multichip modules MCM-V

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