Towards a Universal Model of Dielectric Breakdown

  • Andrea Padovani
  • , Paolo La Torraca
  • , Jack Strand
  • , Alexander Shluger
  • , Valerio Milo
  • , Luca Larcher

Research output: Chapter in Book/Report/Conference proceedingsConference proceedingpeer-review

Abstract

We present a microscopic breakdown (BD) model in which chemical bonds are weakened by carrier injection and trapping into pre-existing structural defects (precursors) and by the electric field. The model goes much beyond the existing ones by consistently explaining the role of both current (a weakness of the E model) and temperature (a weakness of the power-law model), along with the role of the electric field. It also explains the non-Arrhenius temperature dependence of BD. It suggests a new comprehensive physics-based framework (with tight connections to material properties) reconciling the many breakdown theories proposed so far (E, power-law, 1/E,...) within a more universal breakdown model.

Original languageEnglish
Title of host publication2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781665456722
DOIs
Publication statusPublished - 2023
Externally publishedYes
Event61st IEEE International Reliability Physics Symposium, IRPS 2023 - Monterey, United States
Duration: 26 Mar 202330 Mar 2023

Publication series

NameIEEE International Reliability Physics Symposium Proceedings
Volume2023-March
ISSN (Print)1541-7026

Conference

Conference61st IEEE International Reliability Physics Symposium, IRPS 2023
Country/TerritoryUnited States
CityMonterey
Period26/03/2330/03/23

Keywords

  • bond-breakage
  • carriers' injection
  • Dielectric Breakdown
  • Ginestra®
  • precursors

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