@inbook{2be90db3675941c4b2e440e6d619972d,
title = "Transfer Printing for Silicon Photonics Transceivers and Interposers",
abstract = "We present transfer printing as an enabling technology to realize heterogeneous photonic integrated circuits. The approach enables a cost-effective and intimate integration of III-V lasers on advanced high-speed Si PICs. It also enables the integration of III-V and silicon-based opto-electronic components on a passive Si/SiN interposer.",
author = "G. Roelkens and J. Zhang and \{De Groote\}, A. and J. Juvert and N. Ye and S. Kumari and J. Goyvaerts and G. Muliuk and S. Uvin and G. Chen and B. Haq and B. Snyder and \{Van Campenhout\}, J. and \{Van Thourhout\}, D. and Trindade, \{A. J.\} and Bower, \{C. A.\} and J. O'Callaghan and R. Loi and B. Roycroft and B. Corbett",
note = "Publisher Copyright: {\textcopyright} 2018 IEEE.; 7th Annual IEEE Photonics Society Optical Interconnects Conference, OI 2018 ; Conference date: 04-06-2018 Through 06-06-2018",
year = "2018",
month = jul,
day = "27",
doi = "10.1109/OIC.2018.8422030",
language = "English",
isbn = "9781538653524",
series = "2018 7th Annual IEEE Photonics Society Optical Interconnects Conference, OI 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "13--14",
booktitle = "2018 7th Annual IEEE Photonics Society Optical Interconnects Conference, OI 2018",
address = "United States",
}