Transfer printing of III-V devices for silicon photonics

B. Corbett; R. Loi; L. Liu; B. Roycroft; J. O'Callaghan

doi:10.1109/ICIPRM.2019.8819103

Transfer printing of III-V devices for silicon photonics

B. Corbett
, R. Loi
, L. Liu
, B. Roycroft
, J. O'Callaghan

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

Abstract

Compound semiconductors provide exceptional electronic and photonic functionality and integration of these properties into photonic circuits will enable high performance systems. One integration solution is the heterogeneous integration of the high performing components onto a waveguide platform using the technique of micro-transfer-printing (μ TP). We discuss the requirements to implement μTP technology and how the components are registered, released, transferred and integrated with silicon photonics. We envisage that μTP can enable very smart systems at low enough costs for consumer adoption through volume manufacturing.

Original language	English
Title of host publication	2019 Compound Semiconductor Week, CSW 2019 - Proceedings
Publisher	Institute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)	9781728100807
DOIs	https://doi.org/10.1109/ICIPRM.2019.8819103
Publication status	Published - May 2019
Event	2019 Compound Semiconductor Week, CSW 2019 - Nara, Japan Duration: 19 May 2019 → 23 May 2019

Publication series

Name	2019 Compound Semiconductor Week, CSW 2019 - Proceedings

Conference

Conference	2019 Compound Semiconductor Week, CSW 2019
Country/Territory	Japan
City	Nara
Period	19/05/19 → 23/05/19

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

SDG 9 Industry, Innovation, and Infrastructure

Keywords

Heterogeneous integration
lasers
photonic integrated circuits

Access to Document

10.1109/ICIPRM.2019.8819103

Cite this

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title = "Transfer printing of III-V devices for silicon photonics",

abstract = "Compound semiconductors provide exceptional electronic and photonic functionality and integration of these properties into photonic circuits will enable high performance systems. One integration solution is the heterogeneous integration of the high performing components onto a waveguide platform using the technique of micro-transfer-printing (μ TP). We discuss the requirements to implement μTP technology and how the components are registered, released, transferred and integrated with silicon photonics. We envisage that μTP can enable very smart systems at low enough costs for consumer adoption through volume manufacturing.",

keywords = "Heterogeneous integration, lasers, photonic integrated circuits",

author = "B. Corbett and R. Loi and L. Liu and B. Roycroft and J. O'Callaghan",

note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 Compound Semiconductor Week, CSW 2019 ; Conference date: 19-05-2019 Through 23-05-2019",

year = "2019",

month = may,

doi = "10.1109/ICIPRM.2019.8819103",

language = "English",

series = "2019 Compound Semiconductor Week, CSW 2019 - Proceedings",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

booktitle = "2019 Compound Semiconductor Week, CSW 2019 - Proceedings",

address = "United States",

}

Corbett, B, Loi, R, Liu, L, Roycroft, B & O'Callaghan, J 2019, Transfer printing of III-V devices for silicon photonics. in 2019 Compound Semiconductor Week, CSW 2019 - Proceedings., 8819103, 2019 Compound Semiconductor Week, CSW 2019 - Proceedings, Institute of Electrical and Electronics Engineers Inc., 2019 Compound Semiconductor Week, CSW 2019, Nara, Japan, 19/05/19. https://doi.org/10.1109/ICIPRM.2019.8819103

Transfer printing of III-V devices for silicon photonics. / Corbett, B.; Loi, R.; Liu, L. et al.
2019 Compound Semiconductor Week, CSW 2019 - Proceedings. Institute of Electrical and Electronics Engineers Inc., 2019. 8819103 (2019 Compound Semiconductor Week, CSW 2019 - Proceedings).

Research output: Chapter in Book/Report/Conference proceedings › Conference proceeding › peer-review

TY - GEN

T1 - Transfer printing of III-V devices for silicon photonics

AU - Corbett, B.

AU - Loi, R.

AU - Liu, L.

AU - Roycroft, B.

AU - O'Callaghan, J.

PY - 2019/5

Y1 - 2019/5

N2 - Compound semiconductors provide exceptional electronic and photonic functionality and integration of these properties into photonic circuits will enable high performance systems. One integration solution is the heterogeneous integration of the high performing components onto a waveguide platform using the technique of micro-transfer-printing (μ TP). We discuss the requirements to implement μTP technology and how the components are registered, released, transferred and integrated with silicon photonics. We envisage that μTP can enable very smart systems at low enough costs for consumer adoption through volume manufacturing.

AB - Compound semiconductors provide exceptional electronic and photonic functionality and integration of these properties into photonic circuits will enable high performance systems. One integration solution is the heterogeneous integration of the high performing components onto a waveguide platform using the technique of micro-transfer-printing (μ TP). We discuss the requirements to implement μTP technology and how the components are registered, released, transferred and integrated with silicon photonics. We envisage that μTP can enable very smart systems at low enough costs for consumer adoption through volume manufacturing.

KW - Heterogeneous integration

KW - lasers

KW - photonic integrated circuits

UR - https://www.scopus.com/pages/publications/85072978935

U2 - 10.1109/ICIPRM.2019.8819103

DO - 10.1109/ICIPRM.2019.8819103

M3 - Conference proceeding

AN - SCOPUS:85072978935

T3 - 2019 Compound Semiconductor Week, CSW 2019 - Proceedings

BT - 2019 Compound Semiconductor Week, CSW 2019 - Proceedings

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2019 Compound Semiconductor Week, CSW 2019

Y2 - 19 May 2019 through 23 May 2019

ER -

Transfer printing of III-V devices for silicon photonics

Abstract

Publication series

Conference

UN SDGs

Keywords

Access to Document

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