@inbook{dcca0259082c47b3a99108a907a92a50,
title = "Transfer printing of III-V devices for silicon photonics",
abstract = "Compound semiconductors provide exceptional electronic and photonic functionality and integration of these properties into photonic circuits will enable high performance systems. One integration solution is the heterogeneous integration of the high performing components onto a waveguide platform using the technique of micro-transfer-printing (μ TP). We discuss the requirements to implement μTP technology and how the components are registered, released, transferred and integrated with silicon photonics. We envisage that μTP can enable very smart systems at low enough costs for consumer adoption through volume manufacturing.",
keywords = "Heterogeneous integration, lasers, photonic integrated circuits",
author = "B. Corbett and R. Loi and L. Liu and B. Roycroft and J. O'Callaghan",
note = "Publisher Copyright: {\textcopyright} 2019 IEEE.; 2019 Compound Semiconductor Week, CSW 2019 ; Conference date: 19-05-2019 Through 23-05-2019",
year = "2019",
month = may,
doi = "10.1109/ICIPRM.2019.8819103",
language = "English",
series = "2019 Compound Semiconductor Week, CSW 2019 - Proceedings",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "2019 Compound Semiconductor Week, CSW 2019 - Proceedings",
address = "United States",
}
