Trap enhanced Ge/Si photodiode formed by direct bonding: Towards NIR imaging system

Research output: Chapter in Book/Report/Conference proceedingsChapterpeer-review

Abstract

We report a high efficiency normal incidence coupling Ge/Si photodiode formed by direct bonding. The devices exhibit high responsivity up to ∼12A/W at 1.54μm and are suitable for imaging applications. We attribute the enhanced gain to surface trap states between Ge and Si.

Original languageEnglish
Title of host publication2015 IEEE Photonics Conference, IPC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages448-449
Number of pages2
ISBN (Electronic)9781479974658
DOIs
Publication statusPublished - 9 Nov 2015
EventIEEE Photonics Conference, IPC 2015 - Reston, United States
Duration: 30 Aug 201531 Aug 2015

Publication series

Name2015 IEEE Photonics Conference, IPC 2015

Conference

ConferenceIEEE Photonics Conference, IPC 2015
Country/TerritoryUnited States
CityReston
Period30/08/1531/08/15

Keywords

  • Direct-bonding
  • Germanium
  • heterojunction
  • photodiode
  • Silicon

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