Abstract
A concept to develop ultra-compact self-packaged 3D waveguide bandpass filter (BPF) is reported. It is based on inkjet-printed 3D folded-waveguide resonators. Size compactness is achieved using: i) a miniaturized waveguide resonator geometry and ii) monolithic integration by employing a two-material piezo drop-on-demand process. The operating principles of the folded-waveguide resonator concept are presented using eigenmode simulations while taking into consideration the process manufacturing capabilities. The applicability of the folded waveguide resonator concept to highly-miniaturized monolithic BPF is explored through the design and manufacturing of a second-order BPF that exhibits: i) a passband centred at 10.73 GHz with minimum in-band insertion loss (IL) of 2.65 dB and a 3 dB fractional bandwidth (FBW) of 21.6%. Furthermore, it occupies an ultra-compact volume of only 0.34λ0 x 1.26λ0 x 0.16λ0 and only weighs 1.16 g.
| Original language | English |
|---|---|
| Title of host publication | 2025 55th European Microwave Conference, EuMC 2025 |
| Publisher | Institute of Electrical and Electronics Engineers Inc. |
| Pages | 775-778 |
| Number of pages | 4 |
| ISBN (Electronic) | 9782874870811 |
| DOIs | |
| Publication status | Published - 19 Nov 2025 |
| Event | 55th European Microwave Conference, EuMC 2025 - Utrecht, Netherlands Duration: 23 Sept 2025 → 25 Sept 2025 |
Publication series
| Name | 2025 55th European Microwave Conference, EuMC 2025 |
|---|
Conference
| Conference | 55th European Microwave Conference, EuMC 2025 |
|---|---|
| Country/Territory | Netherlands |
| City | Utrecht |
| Period | 23/09/25 → 25/09/25 |
UN SDGs
This output contributes to the following UN Sustainable Development Goals (SDGs)
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SDG 9 Industry, Innovation, and Infrastructure
Keywords
- Additive manufacturing (AM)
- Bandpass filter (BPF)
- Inkjet printing
- Monolithic integration
- Multi-material printing
- Multi-process printing
- Piezo jetting
- Waveguide filter
- [TyndallMicroNano]
- [EngineeringArchitecture]
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