@inbook{3245240f869f43479a41be9733d0cf44,
title = "Ultra-low loss integrated magnetics platform for high frequency power delivery networks",
abstract = "The future smart systems are envisaged to continue shrinking in size and weight, while integrating more features and functionalities, leading to significant increase in power density and efficiency requirements. In addition, devices such as mobile phones and tablet computers require a large reduction in electronic component height. While SMT chip power inductors may have thicknesses as low as 0.6mm; thin film power inductors offer an incremental height of \textasciitilde{}50µm. This paper introduces an ultra-low loss integrated magnetics platform for the next generation power systems on-chip (PwrSoC) and in-package (PwrSiP) applications. The integrated magnetics-on-silicon inductors and transformers have been designed, fabricated using conventional CMOS fabrication processes, and characterized, demonstrating industry-leading performance metrics.",
author = "Pranay Podder and Zoran Pavlovic and Ansar Masood and Guannan Wei and Daniel Lordan and S{\'e}amus O{\textquoteright}Driscoll and Nicolas Peters and Lulu Peng and Zishan Ali and Lawrence Selvaraj and Cheng, \{Chor Shu\} and Cian O{\textquoteright}Mathuna and Paul McCloskey",
note = "Publisher Copyright: {\textcopyright} VDE VERLAG GMBH · Berlin · Offenbach; 11th International Conference on Integrated Power Electronics Systems, CIPS 2020 ; Conference date: 24-03-2020 Through 26-03-2020",
year = "2020",
language = "English",
series = "CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems",
publisher = "VDE Verlag GmbH",
pages = "81--84",
booktitle = "CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems",
}