TY - GEN
T1 - Ultra-low loss integrated magnetics platform for high frequency power delivery networks
AU - Podder, Pranay
AU - Pavlovic, Zoran
AU - Masood, Ansar
AU - Wei, Guannan
AU - Lordan, Daniel
AU - O’Driscoll, Séamus
AU - Peters, Nicolas
AU - Peng, Lulu
AU - Ali, Zishan
AU - Selvaraj, Lawrence
AU - Cheng, Chor Shu
AU - O’Mathuna, Cian
AU - McCloskey, Paul
N1 - Publisher Copyright:
© VDE VERLAG GMBH · Berlin · Offenbach
PY - 2020
Y1 - 2020
N2 - The future smart systems are envisaged to continue shrinking in size and weight, while integrating more features and functionalities, leading to significant increase in power density and efficiency requirements. In addition, devices such as mobile phones and tablet computers require a large reduction in electronic component height. While SMT chip power inductors may have thicknesses as low as 0.6mm; thin film power inductors offer an incremental height of ~50µm. This paper introduces an ultra-low loss integrated magnetics platform for the next generation power systems on-chip (PwrSoC) and in-package (PwrSiP) applications. The integrated magnetics-on-silicon inductors and transformers have been designed, fabricated using conventional CMOS fabrication processes, and characterized, demonstrating industry-leading performance metrics.
AB - The future smart systems are envisaged to continue shrinking in size and weight, while integrating more features and functionalities, leading to significant increase in power density and efficiency requirements. In addition, devices such as mobile phones and tablet computers require a large reduction in electronic component height. While SMT chip power inductors may have thicknesses as low as 0.6mm; thin film power inductors offer an incremental height of ~50µm. This paper introduces an ultra-low loss integrated magnetics platform for the next generation power systems on-chip (PwrSoC) and in-package (PwrSiP) applications. The integrated magnetics-on-silicon inductors and transformers have been designed, fabricated using conventional CMOS fabrication processes, and characterized, demonstrating industry-leading performance metrics.
UR - https://www.scopus.com/pages/publications/85099725041
M3 - Conference proceeding
AN - SCOPUS:85099725041
T3 - CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
SP - 81
EP - 84
BT - CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
PB - VDE Verlag GmbH
T2 - 11th International Conference on Integrated Power Electronics Systems, CIPS 2020
Y2 - 24 March 2020 through 26 March 2020
ER -