Abstract
This paper presents an investigation into the use of high aspect ratio conductors to improve the performance of RF inductors. Also presented is a review of commercially available technologies for RF chip inductors. The objective is to provide an analysis of the inductor parameters against which the high aspect ratio coils can be compared. A range of inductors from 10nH to 100nH in varying footprint areas is designed for fabrication using a novel rapid prototyping technique. High frequency (1GHz) 2-D and 3-D finite element modelling is used to provide an understanding of the behaviour of the high aspect ratio coils. Results from this analysis predict improvement of 15-30% in Q-factors compared planar equivalents.
| Original language | English |
|---|---|
| Pages (from-to) | 177-182 |
| Number of pages | 6 |
| Journal | Proceedings of SPIE - The International Society for Optical Engineering |
| Volume | 3906 |
| Publication status | Published - 1999 |
| Event | Proceedings of the 1999 International Symposium on Microelectronics - Chicago, IL, USA Duration: 26 Oct 1999 → 28 Oct 1999 |
